Solder paste, silver / copper / zinc / cadmium, medium flow. Sold

Formulated especially for gold-filled items, the dispensing applicator on this solder paste provides an ideal solder flow--quickly, efficiently and economically. The paste will adhere wherever applied and leave little or no carbon residue. The extra-easy flow point of 1250F (677C) helps prevent damage to the bonded gold layer caused by overheating. As with all low-karat alloys, the solder will tarnish over time and gold plating is required after soldering to ensure uniformity of color and resist tarnishing.<br /><br /> Paste contains fluorides and cadmium. For safest use, follow manufacturer&#39;s instructions on package. This paste flows at 1250 degrees Fahrenheit. Includes 0.9mm pink tip and 1.2mm green tip.

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